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Power Supply Noise Reduction in Mixed Signal System-On-Chip with Active Decoupling Inductor

S. Seenuvasamurthi, G. Nagarajan

Abstract


When integrating analog and digital circuits onto a mixed-mode chip, power supply noise is a major limitation on the performance of the analog circuitry. As on-chip currents exceed tens of amperes and circuit clock periods are reduced well below a nanosecond, the signal integrity of on-chip power supply has become a primary concern in the integrated circuit design. Several techniques exist for reducing the noise coupling, of which one of the cheapest is separating the power supply distribution networks for the analog and digital circuits. An inductive model is used to characterize the power supply rails when a transient current is generated by simultaneously switching the on-chip registers and logic gates. This paper introduces an active inductor implementation and analyze the various characteristics of the active inductor in the practical scenario. The proposed CMOS active inductor exhibits better power supply noise rejection of 30 dB when the inverter circuit is used as the load. The proposed CMOS active inductor circuit is implemented in GPDK 180nm CMOS technology. Also the simulation result shows that the noise measured is only 5.788 μV with active inductor whereas the noise measured without active inductor is 50 mV.


Keywords


CMOS Active Inductor, Deep Sub-Micron, Power Supply Noise, Technology Scaling.

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References


Ajay Taparia, Bhaskar Banerjee and T. R. Viswanathan, "Power-Supply Noise Reduction Using Active Inductors in Mixed-Signal Systems", IEEE Trans. VLSI systems, vol. 19, no. 11, pp. 1960-1968, Nov. 2011.

S. Kiaei, D. J. Allstot, K. Hansen and N. K. Verghese, “Noise considerations for mixed-signal RF IC transceivers,” ACM J. Wireless Netw., vol. 4, pp. 41–53, Jan. 1998.

D. Leenaerts and P. de Vreede, “Influence of substrate noise on RF performance,” in Proc. Eur. Solid-State Circuits Conf., pp. 300–304, Sep. 2000.

S. Donnay and G. Gielen, Eds., “Substrate Noise Coupling in Mixed Signal ICs”, Dordrecht, The Netherlands: Kluwer, 2003.

A. Afzali-Kusha, M. Nagata, N. K. Verghese and D. J. Allstot, “Substrate noise coupling in SoC design: Modeling, avoidance and validation,” Proc. IEEE, vol. 94, no. 12, pp. 2109–2138, Dec. 2006.

K. Iniewski, Wireless Technologies: “Circuits, Systems and Devices”, Boca Raton, FL: CRC, ch. 20, 2008.

S. Zhao, K. Roy and C.K. Koh, “Decoupling capacitance allocation and its application to power-supply noise-aware floor planning,” IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., vol. 21, no. 1, pp. 81–92, Jan. 2002.

P. Larsson, “Measurements and analysis of PLL jitter caused by digital switching noise,” IEEE J. Solid-State Circuits, vol. 36, no. 12, pp. 1113–1119, Dec. 2001.

M. Badaroglu, P. Wambacq, G. Van der Plas, S. Donnay, G. G. E. Gielen and H. J. De Man, “Digital ground bounce reduction by supply current shaping and clock frequency modulation,” IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., vol. 24, no. 1, pp. 65–76, Jan. 2005.

H.T. Ng and D. J. Allstot, “CMOS current steering logic for low voltage mixed-signal circuits,” IEEE Trans. Very Large-Scale Integr. (VLSI) Syst., vol. 5, no. 5, pp. 301–308, Sep. 1997.

E. Albuquerque et al., “A new low-noise logic family for mixed-signal integrated circuits,” IEEE Trans. Circuit Syst, I, Fundam. Theory Appl., vol. 46, no. 12, pp. 1498–1500, Dec. 1999.

T. Liu, J. D. Carothers and W. T. Holman, “Active substrate coupling noise reduction method for ICs,” Electron. Lett., vol. 35, p. 1631634, Sep. 1999.

A. Taparia, T. R. Viswanathan and B. Banerjee, “Active inductor for power-supply decoupling in mixed signal systems,” in Proc. IEEE Dallas Circuits Syst. Workshop, pp. 1–4, 2008.

Xuan Wang, Jiang Xu, Wei Zhang, Xiaowen Wu, Yaoyao Ye, Zhehui Wang and Zhe Wang, “Actively Alleviate Power Gating-Induced Power/Ground Noise Using Parasitic Capacitance of On-Chip Memories in MPSoC”, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 23, no. 2, pp. 266-279, Feb. 2015.

Bo Zhao and Huazhong Yang, “Supply-Noise Interactions Among Submodules Inside a Charge-Pump PLL”, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 23, no. 4, pp. 771-775, Apr. 2015.

Baker S. Mohammad, Hani Saleh and Mohammed Ismail, “Design Methodologies for Yield Enhancement and Power Efficiency in SRAM-Based SoCs”, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 23, no. 10, pp. 2054-2064, Oct. 2015.

Hailang Wang and Emre Salman, “Decoupling Capacitor Topologies for TSV-Based 3-D ICs With Power Gating”, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 23, no. 12, pp. 2983-2991, Dec. 2015.

Mohammad Beikahmadi, Shahriar Mirabbasi and Krzysztof (Kris) Iniewski, “Design and Analysis of a Low-Power Readout Circuit for CdZnTe Detectors in 0.13-μm CMOS” IEEE Sensors Journal, vol.16, no. 4, pp. 903-911, Feb. 2016.

Xiaoxiao Wang, Member, Dongrong Zhang, Donglin Su, Leroy Winemberg and Mark Tehranipoor, “A Novel Peak Power Supply Noise Measurement and Adaptation System for Integrated Circuits” IEEE Transactions On Very Large Scale Integration (VLSI) Systems, vol.24, no. 5, pp. 1715-1727, May 2016.


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