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PSPICE Simulation of Effect of Ground Bounce in PCB

G. Veera Senthil Kumar, P. Senthil Kumar, Dr. N. Suresh Kumar


Now-a-days the demand on the operating speed of the
devices with larger number of input/output pins is increasing by leaps and bounds. As the devices become faster, their output switching time decreases and causes the “Ground Bounce”. This effect threatens the operation of high-speed digital systems by causing false triggering and affects the signal integrity. This paper investigates the mechanisms causing ground bounce in PCB by deriving equivalent circuit. The techniques of reducing ground bounce are described.Time domain analysis of ground bounce has been performed for multiple traces using SPICE simulation tool.


Signal Integrity, Crosstalk, Simultaneous switching Noise, Micro strip, Ground bounce, SPICE simulation

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