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Improvement of Breakdown Voltage in Quaternary in AlGaN HEMT with Different High-K Passivation Layer for Power Switching Applications

M. Naveen Kumar, N. Anbu Selvan

Abstract


2-D analysis of breakdown characteristics in AlGaN/GaN high electron mobility transistors (HEMTs) is performed by considering a deep donor and a deep acceptor in a buffer layer. The dependence of the OFF-state breakdown voltage on the relative permittivity of the passivation layer εr and the thickness of the passivation layer d are studied. It is shown that as εr increases, the OFF-state breakdown voltage increases. This is because the electric field at the drain edge of the gate is weakened as εr increases. This occurs because in the insulator the applied voltage tends to drop uniformly in general, and hence when the insulator is attached to the semiconductor, the voltage drop along the semiconductor becomes smoother at the drain edge of the gate if the εr of the insulator is higher. It is also shown that the OFF-state breakdown voltage increases as d increases because the electric field at the drain edge of the gate is weakened as d increases. It is concluded that AlGaN/GaN HEMTs with a high-k and thick passivation layer should have high breakdown voltages. . It is well known that the introduction of a field plate enhances the power performance of AlGaN/GaN HEMTs because the socalled current collapse is reduced and the OFF-state breakdown voltage is increased. This increase in the OFF-state breakdown voltage occurs because the field plate reduces the electric field at the drain edge of the gate. However, the introduction of the field plate increases the parasitic capacitance and may degrade the high-frequency performance.

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References


IEEE Transactions On Electron Devices, Vol. 61, No. 3, March 2014. “Numerical Analysis Of Breakdown Voltage Enhancement In Algan/Gan Hemts With A High-K Passivation Layer” Hideyuki Hanawa, Hiraku Onodera, Atsushi Nakajima, and Kazushige Horio, Senior Member, IEEE

H. Onodera and K. Horio, “Analysis of buffer-impurity and field-plate effects on breakdown characteristics in small sized AlGaN/GaN high electron mobility transistors,” Semicond. Sci. Technol., vol. 27, no. 8, pp. 085016-1–085016-6, Aug. 2012.

S. Yang, S. Huang, H. Chen, C. Zhou, Q. Zhou, M. Schnee, et al., “AlGaN/GaN MISHEMTs with high-κ LaLuO3 gate dielectric,” IEEE Electron Device Lett., vol. 33, no. 7, pp. 979–981, Jul. 2012.

Q. Luo and Q. Yu, “Electric field modulation by introducing a HK dielectric film of tens of nanometers in AlGaN/GaN HEMT,” Nanosci. Nanotechnol. Lett., vol. 4, no. 9, pp. 936–939, 2012.

Y. Hao, L. Yang, X. Ma, J. Ma, M. Cao, C. Pan, et al., “Highperformance microwave gate-recessed AlGaN/GaN MOS-HEMT with 73 % power-added efficiency,” IEEE Electron Device Lett., vol. 32, no. 5, pp. 626–628, May 2011.

K. Horio, H. Onodera, and A. Nakajima, “Analysis of backsideelectrode and gate-field-plate effects on buffer-related current collapse in AlGaN/GaN high electron mobility transistors,” J. Appl. Phys., vol. 109, no. 11, pp. 114508-1–114508-7, Jun. 2011.

E. Bahat-Treidel, O. Hilt, F. Brunner, V. Sidorov, J. Würfl, and G. Tränkle, “AlGaN/GaN/AlGaN DH-HEMTs breakdown voltage enhancement using multiple gating field plates (MGFPs),” IEEE Trans. Electron Devices, vol. 57, no. 6, pp. 1208–1216, Jun. 2010.

Brannick, N. A. Zakhleniuk, B. K. Ridley, J. R. Shealy, W. J. Schaff, and L. F. Eastman, “Influence of field plate on the transient operation of the AlGaN/GaN HEMT,” IEEE Electron Device Lett., vol. 30, no. 5, pp. 436–438, May 2009.

K. Horio, A. Nakajima, and K. Itagaki, “Analysis of field-plate effects on buffer-related lag phenomena and current collapse in GaN MESFETs and AlGaN/GaN HEMTs,” Semicond. Sci. Technol., vol. 24, no. 8, pp. 085022-1–085022-7, Aug. 2009.

U. K. Mishra, L. Shen, T. E. Kazior, and Y.-F. Wu, “GaN-based RF power devices and amplifiers,” Proc. IEEE, vol. 96, no. 2, pp. 287–305, Feb. 2008.

C. Liu, E. F. Chor, and L. S. Tan, “Enhanced device performance of AlGaN/GaN HEMTs using HfO2 high-k dielectric for surface passivation and gate oxide,” Semicond. Sci. Technol., vol. 22, no. 5, pp. 522–527, 2007.

K. Horio, K. Yonemoto, H. Takayanagi, and H. Nakano, “Physicsbased simulation of buffer-trapping effects on slow current transients and current collapse in GaN field effect transistors,” J. Appl. Phys., vol. 98, no. 12, pp. 124502-1–124502-7, Dec. 2005.

Y.-F. Wu, A. Saxler, M. Moore, R. P. Smith, S. Sheppard, P. M. Chavarkar, et al., “30-W/mm GaN HEMTs by field plate optimization,” IEEE Electron Device Lett., vol. 23, no. 3, pp. 117–119, Mar. 2004.

Y. Ohno, T. Nakao, S. Kishimoto, K. Maezawa, and T. Mizutani, “Effects of surface passivation on breakdown of AlGaN/GaN high-electronmobility transistors,” Appl. Phys. Lett., vol. 84, no. 12, pp. 2184–2186, 2004.

S. Karmalkar and U. K. Mishra, “Enhancement of breakdown voltage in AlGaN/GaN high electron mobility transistors using a field plate,” IEEE Trans. Electron Devices, vol. 48, no. 8, pp. 1515–1521, Aug. 2001.


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